Zion Market Research Semiconductor and ic packaging materials market | Page 3

Semiconductor and IC Packaging Materials Market
which in turn is anticipated to boost market growth in future. Advancement in technology also
propels the semiconductor and IC packaging materials market.
Global Semiconductor and IC Packaging Materials Market: Segmentation
The global semiconductor and IC packaging materials market is segmented on the basis of
material types as solder balls, organic substrates, lead frames, die-attach materials,
encapsulation resins, bonding wires, and ceramic packages. Of which, the organic substrates
segment is the dominating segment. Organic substrates form a base of the semiconductor
device and are fabricated by another layer to complete the circuit. This material is preferred
over leading frames for industrial use.
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Global Semiconductor and IC Packaging Materials Market: Regional Analysis
Asia Pacific is the leading segment in the global semiconductor and IC packaging market owing
to its increasing population. However, India and China are also emerging as the global leader in
the semiconductor and IC packaging market due to increasing disposal income and favorable
condition for semiconductor industries. Asia-Pacific is expected to remain the major contributor
in the market due to higher investment on electronics applications, low labor cost, low-cost
production, and easily available raw materials. Taiwan and South Korea accounted for largest
market share owing to rapidly developing electronics & semiconductor industries. North America
shows a significant growth in the semiconductor market. Europe is also anticipated to witness
high demand for electronics products.