ZEMCH 2015 - International Conference Proceedings | Page 557

4.4 Wood frame panels: modulation and constructive solutions
The initial idea of interchangeable sub panels was modeled in 3D and it was evaluated through
workshops and meetings with the researchers and experts. It was concluded that although the
proposal was consistent and viable, the technical premises would differ greatly from the system
adopted by the partners. Such a development would require a physical prototyping and measures for recertification by the official agencies. Thus, it was defined as a guideline the application
of the partner company technology.
Initially, wall panels have been conceived: 120 and 60 centimeters wide by 300 centimeters high,
which correspond to the dimensions of the envelope boards. Thus, board cutting would be eliminated, since each would be formed by integral or half sectioned module. However, to provide
better bracing system, the boards must be so arranged that the joints are staggered. From the
definition of the above modules, we saw the need for a minimum of 15cm staggering between
OSB and cementitious boards. Because of the impossibility to develop standards that were not
compatible with partner technology, we chose to adopt the use of the full board (for sealing area),
following a 60 centimeters multiple modulation.
The design development through the 3D modeling of all wall components showed a significant
problem of the system; a high rate of waste due to cuts of OSB and cementititous boards. On the
other hand, a review of the modulation and overlapping of the wall layers allowed material saving
opportunities. This is particularly important when considering the scale of economy. 3D studies
were undertaken to reduce waste in cementituous board due different dimensions between the
outer and inner sides of the panels.
The main issues addressed in the search for the panel modulation were the dimensions compatibility of the cementitious and OSB boards, aiming at the reduction of waste and the diversity of
boards dimensions, besides favoring the production process.

Figure 7: Panel composition

Figure 8: Panel layers

Figure 9: Panels modulation

The study of the panel modulation also provides the possibility of future expansion. Thus, a search
is underway aiming to create “expansion kits” for specific rooms. These kits would be offered as
customization options to be attached to the basic house without any damage to the structure or
the existing modulation.

A design process proposal to brazilian Government’s social housing program

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