technologies market is segmented into 2D IC, 2.5D IC and 3D IC. On the basis of
bumping technology, the market is segmented into copper pillar solder bumping, gold
bumping and others. Moreover, On the basis of industry type, this market is segmented
into automotive & transport, industrial, electronics, IT & telecommunications, healthcare
and others.
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The geographic segment includes North America, Europe, Asia-Pacific and RoW. The
U.S., Mexico and Canada are covered under North America wherein Europe covers
France, Germany, UK, Spain and rest of Europe. Asia-Pacific covers China, India,
Japan, South Korea and Rest of Asia Pacific. Rest of the World (RoW) covers South
America, Middle East and Africa.
Major players for Flip Chip Technologies market are Samsung Electronics Co., ASE
group, GlobalFoundries, Powertech Technology, UMC, Intel Corp, STATS ChipPAC,
Amkor Technology, TSMCamong others.
Scope of Flip Chip Technologies Market
Packaging Technology Segments
•
•
•
2D IC
2.5D IC
3D IC
Bumping Technology Segments
•
• Copper pillar solder bumping,
Gold bumping
• Others
Bumping Technology Segments
•
•
•
Automotive & transport
Industrial
Electronics