Telematics Market Global Scenario Flip Chip Technologies Market

Flip Chip Technologies Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024 Flip chip is the technique for interconnecting semiconductor devices, such as IC chips, to external circuitry with solder bumps that have been dumped onto the chip pads. Flip chip is a semiconductor interconnecting device widely used in various electronic products such as PCs, medical devices and smartphones among others. Some of the major benefits of flip chip are increased packaging density, reduced size & thickness, lower cost, and improved performance of the chip, improved thermal capabilities, and improved reliability. Major driving factors for flip chip technologies market is an emerging internet of things and flip chip is technologically superior to the traditional wire bond electrical connection which is another driver for this market. However, large initial investment required for setting up new manufacturing plant and less availability of customization options are major restraining factors for this market. Increasing growth of demand of sensors in various electronics devices such as smart phones and personal computers is an opportunity factor for this market. Browse Complete Report @ categories/semiconductor-electronics/flip-chip-technologies-market The flip chip technologies market is segmented into packaging technology, bumping technology, industry and geography. On the basis of packaging technology, the flip chip