Global Advanced Packaging Market by
Manufacturers, Regions, Type and Application,
Forecast to 2021
No of Pages – 119
Publishing Date - November 30, 2016
Browse detailed TOC, Tables, Figures, Charts in Global Advanced Packaging Market by
Manufacturers, Regions, Type and Application, Forecast to 2021 at -
http://www.360marketupdates.com/10382775
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer,
logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and
allows the chip to be connected to a circuit board. Typical packaging configurations have included
the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on
package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-
level, flip-chip, and through silicon via setups.
Scope of the Report:
This report focuses on the Advanced Packaging in Global market, especially in North America,
Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market
based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
ASE
Amkor
SPIL
Stats Chippac
PTI
JCET
J-Devices
UTAC
Chipmos
Chipbond
STS
Huatian
NFM
Carsem
Walton
Unisem
OSE
AOI
Formosa
NEPES