NEPCON Thailand 2018 Newsletter #2 NEP_2018_Newsletter #2_Final_L2 | Page 50
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LOCTITE GC 18 – THE GAME CHANGER
ULTRA-LOW VOIDING, TEMPERATURE STABLE SOLDER PASTE
Following the introduction of its award-winning temperature stable
LOCTITE GC 10 solder paste, Henkel has brought to market the
latest product in the LOCTITE GC series. LOCTITE GC 18 upholds the
performance attributes required for demanding SMT environments,
maintaining stability for one year when stored at 26.5°C and for one
month at temperatures up to 40°C. Designed to improve transfer
efficiency for fine-pitch components such as 01005s and 0.4mm CSPs,
the material’s slump resistance at higher soak temperatures allows
for thorough fluxing action on challenging surface finishes such as Cu
OSP and ImSn. As a result, the material also reduces void occurrences
on BGAs, chip resistor (CR), chip capacitor (CC), SOICs, QFPs, and a full
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S., Germany and elsewhere.
© 2018 Henkel Corporation. All rights reserved. (4/18)
range of QFN packages. Sustainability is built in to LOCTITE GC 18 as it
facilitates the elimination of costly nitrogen reflow processes, reduces
rework, lowers processing costs and cuts PPM defects across all areas
of the production line.
CURRENT TECHNOLOGY
VOIDING LEVEL
LOCTITE GC 18 ULTRA-LOW
VOIDING