Manufacturing and Engineering Magazine Volume 425 - January 2016 - Page 18

AEROSPACE TT ELECTRONICS - SEMELAB ing size and weight, whilst maintaining the required performance levels of reliability and thermal efficiency. This capability when combined with TT Electronics research and development support to future market trends and technology emergence, enables Lutterworth to provide our customers with immediate and future solutions.” Major aircraft manufacturer, Airbus, is one example of a partner that has benefitted from TT Electronics’ expertise. This partnership has operated successfully for many years and continues to see innovative techniques applied to products as aircraft become increasingly reliant on electronic systems. The on-going challenge for the A380, as with all most modern aircraft, is a necessity to operate with increased power density, while components work more efficiently and for a longer period of time. Interestingly, the A380 was the first commercial aircraft to use a fully electronic reverse thrust mechanism and the modules for that application were developed by the Lutterworth facility. The current “Modular Development Program” has now further progressed this product to fit multiple applications enabling reduced part count for customers. In this particular case one module Major aircraft manufacturer, Airbus, is one example of a partner that has benefitted from TT Electronics’ expertise. now supports both the fuel transfer and feed pump. This modular solution was also designed to offer an improved mean-timebetween-failure (MTBF) performance and extend its lifespan in line with the aircraft’s operational life. For the next generation of 16 MANUFACTURING AND ENGINEERING MAGAZINE aircraft motor drives, TT Electronics was challenged to develop a solution to align with the customer’s complex circuitry requirements within a low inductance “hybrid” module. This challenge drew significantly on the previous program experience and advanced research on best design material practices of the Lutterworth team which enabled an engineered solution that overcame the high power density required. This was achieved whilst satisfying the significant challenge of thermal bond integrity in application that needed a very thin module that would not warp under the extremes of the functionality required. This type of resourcefulness is a pivotal asset for the Lutterworth site and indeed, the TT Electronics group as a whole. Equally important is their willingness to continually think ahead. This combination provides a strong foundation for the business to anticipate and address emerging market requirements, for example improving the vital thermal performance of its products by employing emerging semiconductor technologies such as silicon carbide and gallium nitride as an alternative to silicon chips.