CIAN IS...
YOUR ACADEMIC PARTNER FOR PHOTONICS PACKAGING
The Center for Integrated Access
Networks
(CIAN)
conducts
advanced 3D packaging and
optical assembly. Additionally,
CIAN can create custom optics,
submounts, enclosures and heat
transfer systems. All devices are
tested and characterized for top
quality and functionality before
release.
Credit: Ficontech
CAPABILITIES
• System design and Analysis
• Wafer scale device fabrication
• Advanced 3-D packaging and
optical assembly
• CNC optics and enclosure fabrication
• Device testing and characterization
ADVANCED 3D PACKAGING AND
OPTICAL ASSEMBLY
• Automated flip chip eutectic/
adhesive die bonding with sub-
micron placement accuracy
• Automated sub-micron pick and
place of optical components
• Active fiber alignment for pigtailing
• Laser soldering, brazing and
welding
• Vacuum oven reflow soldering
• Wafer/chip bumping
Credit (top, bottom left): FIMMWAVE
(bottom right): LightTools
22
CIAN / Center for Integrated Access Networks