Dr. Tae Joon Seok (second from right) visiting the Photon-
ic Packaging Group at the Tyndall Institute (April 2016).
The photo includes Dr Peter O’Brien, Jun Su Lee (packag-
ing group researcher) and Howyuan Hwang (packaging
group PhD student).
His group has developed a range of photonic
packaging technologies which have been made
available to users worldwide through a foundry
service in collaboration with IMEC. They have also
prepared a range of packaging design rules, which
have recently been implemented in PIC design
Dr O’Brien brings expertise across a wide range of tools such as those available through Phoenix
photonic packaging and integration technologies Software and Luceda Photonics. These design
to CIAN, enabling advanced photonic devices to be rules provide valuable guidance to PIC designers,
packaged into fully working prototypes. Collabo- ensuring their photonic devices are compatible
rations began in late 2015 have already shown re- with standard packaging technologies.
sults. Dr. O’Brien has collaborated with Prof. Ming
Wu and his postdoctoral researcher Dr. Tae Joon
Seok to demonstrate packaging of UC Berkeley’s
MEMs optical switch.
This enabled a fully packaged device to be tested
in systems experiments performed by Prof. George
Papen at UCSD. Results from this collaboration
were presented at CIAN’s annual review in Colum-
bia University last May, and a paper about this work
will be presented at the IEEE Photonics Conference
(IPC) in October. Further collaborations have start-
ed with Prof Keren Bregman (Columbia) and Prof.
Robert Norwood (Arizona).
Dr. O’Brien explains photonics to a group of children at
an outreach event at the Geasa-Marana Library in Mara-
na, AZ
www.cian-erc.org
19