2021 Global Thermal Interface Materials Market Growth Forecast May 2017

Global Thermal Interface Materials Market 2017-2021
Global Thermal Interface Materials Market report covers the present scenario and the growth prospects
of the industry for 2017-2021. To calculate the market size, the report considers the revenue generated
in terms of value for the market. The analysts forecast global thermal interface materials (TIMs) market
to grow at a CAGR of 11.30% during the period 2017-2021.
Thermal interface materials (TIMs) are used for dissipating excessive heat generated from a heat source
in various equipment. They are generally used in the form of a secondary thermal conductive material to
replace the thermally insulating air between the surfaces.
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Market driver
Advantages of TIM.
Market challenge
Ease of availability of alternative technologies.
Market trend
Advances in technology.
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Key vendors
The key players in the Thermal Interface Materials Market are Dow Corning, Henkel, Honeywell, Laird,
Momentive.
Other Prominent Vendors
Other Prominent Vendors in the market are 3M, Akasa group, Indium Corporation, Parker Chomerics,
Zalman.
The report, Global Thermal Interface Materials Market 2017-2021, has been prepared based on an in-
depth market analysis with inputs from industry experts. This report covers the market landscape and its
growth prospects over the coming years. The report also includes a discussion of the key vendors
operating in this market.
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interface-materials-tims-market-2017-2021.html
Table of Contents of the Report
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology